Prednosti COB-a

COB refers to the bonding and packaging of chips directly on the whole substrate. That is, N chips are inherited and integrated on the inner substrate for packaging. It is mainly used to solve the problem of low-power chip manufacturing high-power LED lamp, which can disperse chip heat dissipation, improve light efficiency, and improve the glare effect of LED lamp at the same time. COB has high luminous flux density, less glare and soft light. It sends out a uniformly distributed light surface. At present, it is widely used in bulb, spotlight, downlight, fluorescent lamp, street lamp, industrial and mining lamp and other lamps.